World-Class Resources > CNSE Wafer Processing Research & Development > Film Deposition > Dielectric Films

Tools - Four Applied Materials Producers

FEOL Films:

• HARP - STI trench fill
• Compressive and Tensile Nitride
• Oxide Spacer
• Nitride Spacer
• Advance Patterning Film/Amorphous Carbon Layer
• PMD Oxide

BEOL Films:

• SiCOH/OMCTS (k=3.0) (BD)
• pSiCOH (k=2.4, 2.7) with UV cure   (BD)
• Silane Oxide and Nitride
• SiCN
• TEOS