World-Class Resources > 200mm Wafer Fabrication > Processing Capabilities

• Silicon, Glass, others
  • Wafer patterning/etching, Surface treatments
• Thin Film Deposition
  • PVD, ALD, PECVD, Evaporation
• Etching 
  • Wet 
  • TMAH, KOH
  • Dry (Bosch) for Silicon
  • Oxygen for Oxides and Nitrides
• Wafer Patterning (EVG Bonder/Aligner Tool Sets)
  • Materials
    • Photoresist
    • LOR
    • BCB
    • Polyimide
    • Others
  • Front Side
  • Front to Backside
• Wafer Bonding Processes
  • Silicon/Glass (Anodic)
  • Termo-Compression Bonding (Cu-Cu)
  • Epoxy Bonding (BCB and others)
  • Temporary Bonding
• Ion Implantation
  • Accelerator
• CMP
• 100 to 200 mm substrates
• Post Processing
• RTA

CNSE 200 has a full suite of Semiconductor Processing and Metrology Tools. Shown below are some of the common tools used for nearly all devices. 

Brewer Science CEE 100 Spin Coater

EVG 640 Contact Aligner

EVG 501 Wafer Bonder

PlasmaTherm Versalock 700 Dry Etcher