SEMATECH

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  ISMI is the world's top technology leader responsible for the development and implementation of international nanoelectronics manufacturing roadmaps and standards, and will partner with CNSE on advanced manufacturing technologies that are critical to enabling fabrication of multi-functional computer nanochips, which drive nearly every facet of society, from the electronics, information technology, automotive and military sectors to emerging opportunities in clean energy and health care, among many others.

  SEMATECH hosts and administers over 12 centers and consortia, including the EUV Resist Test Center, EUV Mask Blank Development Center, EUV Process Development Center, Alternative Lithography Technologies Center, 3D Interconnect Center, Advanced Metrology Center, the Universal Nanoelectronics Institute for Technology and Education, and the New York Alliance for Advanced Science and Technology. Examples of technical programs include:
  

  • 193i: Assess extensibility of immersion beyond 45 nm half-pitch, by improving fluids, lens materials, and resists.
  • EUV: Prepare EUV infrastructure for insertion at 32 nm half-pitch technology generation, using new micro-exposure and full field tools at resist test centers; work toward defect-free mask blanks.
  • 3D: Pursue wafer-to-wafer and die-to-wafer integration by roadmapping technology options, developing unit processes and metrology, and demonstrating functionality and reliability.
  • Metrology: Focus on the invention, research, development, and application of measurement methods for advanced technologies, with expanded programs in advanced microscopy, and metrology for CMOS and nanotechnology applications.

  SEMATECH first took root at CNSE in 2002, with the establishment of a $400-million, next-generation 300mm R&D center at CNSE's Albany NanoTech complex. To support the program, New York State contributed substantial funding along with SEMATECH and its member companies, including IBM, with initial project research aimed at R&D in the area of advanced lithography infrastructure for extreme ultraviolet (EUV) lithography, which is crucial for computer chip manufacturing technology in the future because technical advances are expected to cause present day manufacturing methods to become obsolete for the most advanced chips.