About Us > Faculty & Staff > Technical Staff > Warren Montgomery

Assistant Vice President Advanced Technology Business Development

wmontgomery@albany.edu

Professional Background:

• Program Manager and Principal Engineer, College of Nanoscale Science and Engineering, University at Albany
• Process Development Manager, Etec an Applied Materials Company
• Account Manager / Implant Resist Team Leader, AZ Microelectronics
• Photo Process Team Leader / Engineer 4, LSI Logic Corp.
• Senior Internal Applications Engineer, ASML (Netherlands)
• Senior Scientist, IBM Corp.

Education:

• MBA, City University, Bellevue, WA
• B.S. Chemistry, Marist College, Poughkeepsie, NY
• B.S. Business Administration, Mount Saint Mary College, Newburgh, NY
• A.S. Chemistry and Biology, Dutchess Community College (SUNY), Poughkeepsie, NY

Responsibilities:

As INVENT Program Manager, Mr. Montgomery is responsible for assuring the smooth operation of INVENT related tool installations, process tool time assignment and helping to keep the program focused on its objectives.

As a Principal Engineer, Mr. Montgomery is the key lithography interface and drives the resolution on photo related questions/problems.

Mr. Montgomery is also the Primary Investigator for a number of other projects at CNSE.

Patents:

Highly Sensitive DUV Resist #5023164

Speed Enhancers for Acid Sensitized Resist #5164278

Positive Photoresist for Near UV and Visible Imaging #5272042

New Silicon Containing Photoresist #5338818

Fast Diazoquinone Photoresist #5362599

Top Surface Imaging Technique using a Topcoat Delivery System #6258514

Method of reshaping a patterned organic photoresist surface #6582861

Uniform Coated Photoresist Compositions #EP00542411A1

Chemically Amplified Photoresist #EP00388343A1

Speed enhancers for acid sensitized resists #EP0445058B1

Fast Diazoquinone Positive Resists #EP0542659B1

Method of extending the stability of a photoresist during direct writing of an image upon the photoresist #6727047

Method of extending the stability of a photoresist during direct writing of an image #6969569

Method of increasing the shelf life of a blank photomask substrate #6998206

Sensitized chemically amplified photoresist for use in photomask fabrication and semiconductor processing #7067227

Method of increasing the shelf life of a photomask substrate #7135256

Professional Memberships:

• BACUS Steering Committee 2005-present
• BACUS Chairman Photomask Equipment - Japan Session 2004
• Member of the Portland Community College Lithography Program Steering Committee 2003-2005
• BACUS Chairman "Photomasks Process & Materials" 2001-2003

Technical Papers:

"Non-metallic acid generators for I-line and g-line chemically amplified resist," SPIE Vol. 1466; 1991 p368-76

"Ultrasensitive chemically amplified resist," Microelectronics Engineering Vol. 13, no 1-4 March 1991 p19-22

"Sensitivity enhances for chemically amplified resist," SPIE Vol. 1262; 1990; p162-9

"Photoresist performance evaluations of implant resist systems," SPIE Vol. 3333, pt. 1-2 1998, p1337-59

"Lithography evaluation of a high performance photoresist composition," SPIE Vol. 3333, pt. 1-2 1998; p1314-22

"Shot size reduction of photoresist formulations," SPIE Vol. 2438, 1995; p646-58. 20-22 Feb. 1995

"Photolithographic Evaluation of Various Resist Materials for Mask Making Applications," Advances in Resist Technology and Processing XVIII; Francis M. Houlihan, Conference Chair, 2001

"Photolithographic Evaluation of Deep UV Resist Materials for Mask Making Applications," Advances in Resist Technology and Processing XVIII; Francis M. Houlihan, Conference Chair, 2001

"Process Development Enabling DUV Lithography at 257nm," ET Conference, Santa Clara, CA 2001 (awarded Best Paper)

"Immersion Lithography: Throughput Optimization for the 90 nm Node and Beyond," Brewer Science Lithography Symposium, Hillsboro, OR 2006

"Initial experience establishing an EUV baseline lithography process for manufacturability assessment," Emerging Lithographic Technologies XI, SPIE 2007

"Immersion Defectivity Advanced Lithography," Advances in Resist Materials and Processing Technology XXIV SPIE 2007