About Us > Faculty & Staff > Technical Staff > Christopher Borst

Associate Vice President for G450C Technical Operations

cborst@albany.edu

Read Chris Borst's Nanotechnology Now Article: Advancing Nanoscience through R&D Consortia

Professional Background:

• Assistant Vice President for Module Engineering, CNSE, University At Albany, 2008-2012
• Process Engineering Manager, College of Nanoscale Science and Engineering, University at Albany, 2007-2008
• Program Manager - Semiconductor Research, College of Nanoscale Science and Engineering, University at Albany, 2006-2007
• Member of Technical Staff, Texas Instruments Kilby Center Silicon Technology Development Group, 2001-2006

Education:

• PhD - Chemical Engineering, Rensselaer Polytechnic Institute, Troy, NY 2000
• BS - Chemical Engineering, University of Virginia, Charlottesville, VA 1996

Responsibilities:

Dr. Borst coordinates and manages 450mm day-to-day wafer manufacturing and related equipment activities for  G450 Consortium cleanroom operations. He is also responsible for personnel management of Research Foundation engineer and technician assignees to G450C.

As Associate Vice President for G450C Technical Operations, Chris is involved with building the G450C manufacturing/development organization from startup through ramp. He is responsible for cleanroom manufacturing support functions, and interactions with site EHS, facilities, and contractors. He also partners with the equipment and process engineering teams to coordinate the installation and process ownership of 450mm equipment. In his role, Dr. Borst manages workflow operations for the generation of 450mm test wafers and equipment demonstrations.

Awards:

• SRC Graduate Fellowship, 1997-2000

Professional Memberships/Organizations:

• Co-chairman, Materials Research Society (MRS) Spring 2013 Conference Symposium BB
• Co-chairman, Materials Research Society (MRS) Spring 2010 Conference Symposium E
• Co-chairman, Materials Research Society (MRS) Spring 2007 Conference Symposium C
• Executive Committee, IMIC CMP-MIC 2006
• Advisory Committee, SRC ERC Planarization Research Tasks 2005-present
• SRC Graduate Fellowship, 1997-2000
• Peer-reviewer, Thin Solid Films, Journal of the Electrochemical Society, IEEE Transactions on Semiconductor Manufacturing, and The ASME Journal of Manufacturing Science and Engineering

Patents:

6,693,357 - Methods and Semiconductor Devices with Wiring Layer Fill Structures to Improve Planarization Uniformity

6,776,688 - Real-time Polishing Pad Stiffness Control Using Magnetically Controllable Fluid

7,268,073 - Post-polish Treatment for Inhibiting Copper Corrosion

Books:

C. L. Borst, W. N. Gill, and R. J. Gutmann
CMP of Low-k Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Boston: Kluwer Academic Publishers (2002)

Refereed Publications:

Z. Li, D. Truque, D. Boning, R. Caramto, and C. Borst
"Modeling Wafer Level Uniformity in Electrochemical-Mechanical Polishing (ECMP)"
24th Proceedings of the Advanced Metallization Conference, Albany NY, October (2007)

C. Borst, L. Huli, S. Bennett, H. Dai, C. Bencher, and Y. Chen
"Driving Metallization Dimensions to Sub-30nm using Immersion Lithography and a Self-Aligned Double Patterning Scheme"
24th Proceedings of the Advanced Metallization Conference, Albany NY (2007)

T. Park, T. Tugbawa, D. Boning, C. Chidambaram, C. Borst, and G. Shinn
"Chip-Scale Modeling of Electroplated Copper Surface Profiles"
J. Electrochem. Soc. 151(6), C418 (2004)

M. Eissa, D. Ramappa, E. Ogawa, E. Zielinski, C. Borst, G. Shinn, and A. McKerrow
"Defect Reduction Challenges in the Integration of Copper CMP for 90nm Technology"
21st Proceedings of the Advanced Metallization Conference, San Diego, CA, October (2004)

C. L. Borst, S. Smith, and M. Eissa
"Challenges and Rewards of Low-abrasive Copper CMP: Evaluation and Integration for Single-Damascene Cu/Low-k Interconnects for the 90nm Node"
Proceedings of the Materials Research Society 816, 3 (2004)

C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann
"Chemical-mechanical Planarization of Low-k Polymers for Advanced IC Structures"
Transactions of the ASME, Jrnl. Of Electronic Packaging 124(4), (2002)

C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann
"Surface Kinetics Model for SiLK Chemical Mechanical Polishing"
J. Electrochem. Soc. 149(2), G118 (2002)

D. G. Thakurta, C. L. Borst, D. W. Schwendeman, R. J. Gutmann, and W. N. Gill
"Three-Dimensional Chemical Mechanical Planarization Slurry Flow Model Based on Lubrication Theory"
J. Electrochem. Soc. 148(4), G207 (2001)

C. L. Borst, V. Korthuis, G. B. Shinn, J. D. Luttmer, R. J. Gutmann, and W. N. Gill
"Chemical-Mechanical Polishing of SiOC Organosilicate Glasses: The Effect of Film Carbon Content"
Thin Solid Films 385, 281 (2001)

D. G. Thakurta, C. L. Borst, D. W. Schwendeman, R. J. Gutmann, and W. N. Gill
"Pad Porosity, Compressibility, and Slurry Delivery Effects in Chemical-Mechanical Planarization: Modeling and Experiments"
Thin Solid Films 366, 181 (2000)

C. L. Borst, W. N. Gill, and R. J. Gutmann
"Chemical-Mechanical Planarization of BCB and SiLK Interlevel Dielectrics with Varied Cure Conditions in Copper Slurries"
Int. Jrnl. Of Chemical-Mechanical Planarization for On-Chip Interconnection 1(1), 26 (2000)

C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann
"Chemical-Mechanical Polishing Mechanisms of Low-k Polymers in Copper Slurries"
J. Electrochem. Soc.146(11), 4309 (1999)

C. Borst, S. Grzegorczyk, S. Strand, and G. Carta
"Equilibrium and Mass Transfer of Amino Acids in Cationic Exchangers: Temperature Effects"
Reactive and Functional Polymers 32, 25 (1997)

Conference Publications and Presentations:

R.-H. Baek, C. Y. Kang, A. Kumar, C.-W. Sohn, T. Michalak, C. Borst, C. Hobbs, P. Kirsch, R. Jammy, "ìComprehensive Study of Process-Induced Device & Circuit Performance Variability and its Optimization for 14 nm Technology Node Bulk FinFETsî," VLSI (2012) submitted

C. Borst, "ìNanotechnology Process and Equipment Development Enabled by Consortia-based R&Dî," SemiconWEST (2012) accepted

M. Liehr and C. Borst, "ì300mm Wafer-Scale Integrated Processing Capability for Research and Development on Novel Materials and Device Conceptsî," GOMACTECH (2010)

C. L. Borst, S. G. Bennett, Z. R. Robinson, D. R. Steinke, S. A. McTaggart, J. G. Ryan, J-U. Lee, "Oxide / Polysilicon CMP Process Integration for Novel Graphene and Carbon Nanotube Devices", Proc. 13th CMP-MIC Conference, 295 (2008)

X. Miao, L. Huli, H. Chen, X. Xu, H. Woo, C. Bencher, J. Shu, C. Ngai, C. Borst, "Double Patterning Combined with Shrink Technique to Extend ArF Lithography for Contact Holes to 22nm Node and Beyond", Proc. SPIE 6924, 69240A (2008)

C. L. Borst, I. Ul-hasan, R. E. Geer
"Investigations of Nanoparticle Abrasive Retention in Polyurethane CMP Pads post- Cu CMP"
3rd Meeting of the Levitronix CMP User's Group, San Francisco, CA (2007)

P. Chidambaram, C. Borst, T. Tugbawa, H. Chen, S. Sherrof, B. Lee, D. White, T. Smith, and G. Shinn
"Evaluation of Dummy Metal Design by Electro-chemical Copper Deposition (ECD) and Chemical Mechanical Polishing (CMP) Modeling"
IEEE International Electron Devices Meeting, San Francisco, CA, December (2004)

R. J. Gutmann, C. L. Borst, and W. N. Gill
Invited Presentation: "CMP of Low Dielectric Constant Polymers and Organosilicate Glasses - Fundamental Mechanisms and Copper Damascene Implications"
204th Meeting of the Electrochemical Society, Orlando, FL, Abs 901 October (2003) T. Park,

T. Tugbawa, D. Boning, C. Borst, G. Shinn, and P. Chidambaram "Instantaneous Removal Rate in Copper CMP"
Proc. CMP Users Group Meeting, San Jose CA, (2001)

C. L. Borst, D. G. Thakurta, W. N. Gill, and R. J. Gutmann
Invited Paper: "Chemical-Mechanical Planarization of low-k Polymers for Advanced IC Structures"
Polymer Material Workshop, London, England, December (2000)

R. J. Gutmann, C. L. Borst, B.-C. Lee, D. G. Thakurta, D. J. Duquette, and W. N. Gill
Invited Paper: "Chemical-Mechanical Polishing of Copper and SiLK in Model Alumina Slurries: Experimental and Modeling Results" 17th VMIC Conference, Santa Clara, CA, June 26-30, 123 (2000)

C. L. Borst, R. J. Gutmann, and W. N. Gill
Invited Paper: "Mechanisms for Chemical-Mechanical Planarization of Low Dielectric Constant Polymers in Copper Slurries"
16th VMIC Conference, Santa Clara, CA, September 7-9, 207 (1999)

C. L. Borst, W. N. Gill, and R. J. Gutmann
Poster Paper: "Chemical-Mechanical Planarization of BCB and SiLK Low-k Polymer Interlevel Dielectrics in Copper Slurries"
4th VMIC CMP-MIC Conference, Santa Clara, CA, February, 409 (1999)

C. L. Borst, Y. Xiao, R. J. Gutmann, and W. N. Gill
Invited Presentation: "CMP of Polymers in Copper Slurries: Future Needs and Present Understanding"
Clarkson CMP Conference, Lake Placid, NY, August (1999)

C. L. Borst, R. J. Gutmann, and W. N. Gill
Invited Presentation: "CMP of Organic Low-k Dielectrics: Chemical Alteration and Effect on Removal Rate"
SRC Graduate Fellowship Annual Conference, Austin, TX, September 13-14 (1999)