About Us

Skip Navigation LinksAbout Us > Faculty & Staff > Executive Staff > Michael Tittnich
Michael Tittnich

Michael Tittnich
CNSE Associate Vice President for Technical Operations

mtittnich@albany.edu

Professional Background:

  • Motorola, Inc. Phoenix, AZ, and Austin, TX
    • Advanced Product Research and Development Laboratories: Evaluation and integration of advanced lithographic techniques into high volume manufacturing.
    • Microcontroller Products Group: Engineering Manager, Front End and Back End Operations
  • Philips Semiconductor, NV. Eindhoven, Netherlands
    • Philips National Laboratories: Advanced Wafer Fab Startup Operations and Process Transfer, Plasma Processes Development and Integration
  • BSc., Biology, Miami University, Oxford, OH
Accomplishments:
  • Leader of multiple international and domestic wafer fab start up teams
  • Implemented world's first commercial immersion lithography system
  • Keynote address to SPIE on Immersion Lithography, 2006
  • IMPLSE Program Executive Director
  • Over 20 years experience in advanced semiconductor process engineering operations
Awards:
  • Tech Valley Summit MIKE (Mentorship, Innovation, Knowledge, and Entrepreneurship)
Selected Publications:

"Field performance of the EUV alpha demo tools", H. Meiling, V. Banine, K. Cummings, M. Goethals, N. Harned, B. Hultermans, P. Kürz, S. Lok, M. Lowisch, H. Meijer, U. Mickan, K. Ronse, J. Ryan, M. Tittnich, and J. Zimmerman, Proc. SPIE 6921, (2008).

"EUV lithography with the Alpha Demo Tools: status and challenges",
Noreen Harned, Mieke Goethals, Rogier Groeneveld, Peter Kuerz, Martin Lowisch, Henk Meijer, Hans Meiling, Kurt Ronse, James Ryan, Michael Tittnich, Harm-Jan Voorma, John Zimmerman, Uwe Mickan, and Sjoerd Lok
Proc. SPIE Vol. 6517, 651706 (2007)

"A year in the life of an immersion lithography alpha tool at Albany NanoTech", (Keynote) M. Tittnich, J. Hartley, G. Denbeaux, U. Okoroanyanwu, H. Levinson, K. Petrillo, C. Robinson, D. Gil, D. Corliss, D. Back, S. Brandle, C. Schwarz, F. Goodwin, Y. Wei, B. Martinick, R. Housley, P. Benson and K. Cummings, Proc. SPIE 6151, 615101 (2006